LOW DK & DF

통신 장비, 네트워크 장비, 고주파 측정 장비 등

분류

저 유전 상수

소매가

0.0

元

시장가

0.0

元

조회수:

1000

상품번호

수량

재고:

분류

다시 목록으로



제품 세부 정보

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LOW DK & DF

LOW DK & DF



Low Loss&High Heat Resistance Material

특징 Dk/Df(10GHz):3.5~4.0/0.0065~0.0075 낮은 Z축 팽창 계수, 탁월한 관통 홀 신뢰성 저흡수율				*응용 분야* 통신 장비, 네트워크 장비, 고주파 측정 장비 등

*FEATURES* Dk/Df(10GHz):3.5~4.0/0.0065~0.0075 Lower Z-axis CTE , offering superior PTH reliability Lower moisture absorption				*APPLICATIONS* Network equipment , High frequency measuring instruments etc.

*GENERAL PROPERTIES*
Test ltem		Unit	Test Method		Treatment Condition	Property Data
						SPEC	Typical Value
Thermal	Glass Transition Temperature,Tg	℃	DMA		A	＞180	200
	Thermal Expansion, Z-CTE	ppm/℃	IPC-TM-650 2.4.24		Before Tg	＜60	45
					After Tg	＜260	210
					50-260℃	＜3.0	2.6
	Decomposition Temperature,Td	℃	IPC-TM-650 2.4.24.6 5%wt loss		A	＞370	383
	Delamination Time,T288	Min	IPC-TM-650 2.4.24		A	＞60	120
	Delamination Time,T300	Min	IPC-TM-650 2.4.24		A	＞30	60
	Humidity Resistant	Cycle	/		85℃/85%RH,168hr 288℃/10sec,Dipping	＞3	＞10
Dlelectrlc	Dielectric Constant,(DK)	/	IPC-TM-650 2.5.5.9		1GHz	3.85
		/	SPDR,RC55%		10GHz	4.05
	Dissipation Factor(Df)	/	IPC-TM-650 2.5.5.9		1GHz	0.0035
		/	SPDR,RC55%		10GHz	0.0068
Physlcal	Peel Strength, RTF/1OZ	IBS/IN	IPC-TM-650 2.4.8		288℃/10s	＞4	5.8
	Water Absorption	%	IPC-TM-650 2.6.2.1		\	＜0.35	0.09
	Flammability	/	UL94		A	V0	V-0(Br)
Note: the treatment of letters and numerical meaning A - plate delivery stage D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃) des - drying 10 minutes or more or drying condition cooling to room temperature.

　　Dielectric Constant and Disspation Factor

PURCHASING INFORMATION


Thickness	Copper foil	Standard Size
0.8mm to 3.4mm	12μm to 105μm	1041×1245mm（41″×49″） 940×1245mm（37″×49″） 1092×1245mm（43″×49″）
※ Other sheet size and thickness could be available upon request.