금속베이스

고전력 LED 조명, 전원 회로, LEDTV 등에 적합。

분류

금속베이스

소매가

0.0

元

시장가

0.0

元

조회수:

1001

상품번호

수량

재고:

분류

다시 목록으로



제품 세부 정보

[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[[产品参数, 参数]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]]

금속베이스

Aluminum Base CCL

특징 우수한 방열성 우수한 박리 강도 우수한 내열성 및 절연 신뢰성 우수한 가공성				응용 분야 고전력 LED 조명, 전원 회로, LEDTV 등에 적합。

*FEATURES* Superior Heat Dissipation High Peel Strength Excellent Thermal Reliability and Insulation Reliability Excellent Processability				*APPLICATIONS* Suitable for high-power LED lighting，power supply board，LED TV，and etc。

*GENERAL PROPERTIES*
Test Item			Test condition		Units	Typical value
Peel Strength , LBS/IN,Minimum,1 OZ			288℃/10sec		LBS/IN	11.7
Volume resistivity ,Minimum At elevated temperature E-24/125			E-24/125		MΩ.cm	≥108
Surface resistivity , Minimum At elevated temperature E-24/125			E-24/125		MΩ	≥108
Thermal Stress			288℃,solder dip		Min	10
			288℃,solder float		Min	30
Dielectric Breakdown, Minimum			D-48/50 D-0.5/23		Kv	6.0
Thermal Conductivity		Dielectric layer	ASTM D5470		W/(m﹒K)	2.0
Thermal Resistance					K﹒cm2/W	0.57
Dielectric Constant			C-24/23/50,1MHz		-	5.3
			C-24/23/50,1GHz		-	5.1
Dissipation Factor			C-24/23/50,1MHz		-	0.022
			C-24/23/50,1GHz		-	0.018
CTI			IEC60112 Method		V	200
Flammability			UL-94		-	V-0
Glass Transition Temperature			DSC		℃	140
CTE(Z-axis)	Before Tg		TMA		ppm/℃	27
Decomposition Temperature(Td)			TGA(5% Weight Loss)		℃	390
Note: the treatment of letters and numerical meaning A - plate delivery stage D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃) des - drying 10 minutes or more or drying condition cooling to room temperature.

　　Peel strength Reliability

※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION


	Material	Type
Cu	E/D Cu	HOZ、1OZ、2OZ
Dielectric Layer	Epoxy resin filled with inorganic filler	75μm-120μm
Base Metal Plate	1060 Al	0.3mm-3.0mm
	1100 Al
	3003 Al
	5052 Al
Masking Film	PET/PI Film	2.5mil
Standard Size	914mm×1219mm（36＂×48＂）；1016mm×1219mm（40＂×48＂）1000mm×1200mm； 500mm×600mm
※ Other sheet size and thickness could be available upon request.